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LG Innotek to slim down smartphones by replacing solder balls with copper posts
(www.tomshardware.com)
this post was submitted on 08 Jul 2025
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"LG proposes eliminating solder balls"
"By instead using copper, with solder balls on top"
What?
The article is utter garbage and misunderstands dimensions.
The new strategy allows for pads to be closer together not for the whole thing to be flatter. It allows to shrink sideways, not in height.
My phone is thinner sideways than most, and it's often a problem when browsing websites that make assumptions about screen dimensions.
Again, it's about shrinking chips, not shrinking phones. With smaller chips there is more space for other things like slightly larger batteries. Phone size is not dictated by chip size.
"It allows to shrink sideways" sounded like it was referring to phone dimensions. I must have misunderstood what you were saying.
Don't worry, you aren't the only one, the tomshardware article had the same misunderstanding.
The only thing this change does is that the pads of the chip packages can be spaced tighter together, which allows the packages of the chips to be smaller sideways. It doesn't change the height of the chips.
And yet not only did the original article misunderstand that sideways isn't height, they also thought that making the chip packages narrower will directly lead to the phone getting slimmer.